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HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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5 Years

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BT material semiconductor Pacakge Substrate L/S 35/35um

HongRuiXing (Hubei) Electronics Co.,Ltd.
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BT material semiconductor Pacakge Substrate L/S 35/35um

Brand Name : Horexs

Model Number : HRX

Certification : UL

Place of Origin : CHINA

MOQ : 1 square meter

Price : US 120-150 per square meter

Payment Terms : Western Union, MoneyGram, T/T, L/C

Supply Ability : 30000 square meters per month

Delivery Time : 7-10 working days

Packaging Details : carton customized

Package type : BGA package

Material : BT

Line spec. : 35/35um

Layers : 4 layer

Surface finished : ENEPIG/ENIG/Soft gold

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BOC pacakge substrate manufacture with short delivery time

Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate,Semiconductor package;

Spec.of pcb production:

Mini.Line space/width 1mil (20um)
Finished thickness BT (0.1-0.4mm) finished thickness
Mainly brand SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others
Surface finished Mainly immersion gold,ENEPIG,support customize such as OSP/Immersion silver,tin,more
Copper 0.5oz or Customize
Layer 1-6 layer (Customize)
Soldermask reen or Customize (Brand:Soldermask:TAIYO INK,ABQ)
Improved tenting process 20/20um

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer substrate,please also provide us layer stack-up information;

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

Want Better price,Better quality substrate? Contact Horexs now!

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)


Product Tags:

BT FR4 BOC Pacakge Substrate

      

Improved Tenting BOC Pacakge Substrate

      

BOC Pacakge fr4 substrate

      
Quality BT material semiconductor Pacakge Substrate L/S 35/35um for sale

BT material semiconductor Pacakge Substrate L/S 35/35um Images

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